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TO63-03A Hermetic Sealing Package for Power Devices

Huona (Shanghai) New Material Co., Ltd.
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    Buy cheap TO63-03A Hermetic Sealing Package for Power Devices from wholesalers
     
    Buy cheap TO63-03A Hermetic Sealing Package for Power Devices from wholesalers
    • Buy cheap TO63-03A Hermetic Sealing Package for Power Devices from wholesalers

    TO63-03A Hermetic Sealing Package for Power Devices

    Ask Lasest Price
    Brand Name : HUONA
    Model Number : top
    Certification : ISO9001
    Price : Bargain
    Payment Terms : T/T
    Supply Ability : 100000 A WEEK
    Delivery Time : A WEEK
    • Product Details
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    TO63-03A Hermetic Sealing Package for Power Devices

    Product Overview

    Product Name: TO63-03A Hermetic Sealing Package
    Model Number: TO63-03A
    Package Type: TO-style metal can (Transistor Outline)
    Sealing Technology: Glass-to-Metal Sealing (GTMS)
    Materials:

    • Housing: Kovar alloy (Fe-Ni-Co) or stainless steel

    • Pins: Kovar, Dumet, or custom conductive materials

    • Insulation Medium: Borosilicate or high-insulation glass


    Key Features & Advantages

    • Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications

    • Wide temperature range from -55°C to +300°C for use in extreme environments

    • Strong mechanical structure with high resistance to vibration and shock

    • Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices

    • Full customization available: pin configuration, plating thickness, housing size, materials, etc.


    Technical Specifications (Customizable)

    ItemSpecification / Range
    Housing MaterialKovar alloy or 304 stainless steel
    Number of Pins3 pins (customizable to 4, 6,8 etc.)
    Plating OptionsNickel, Gold (0.5–2μm thickness)
    Glass InsulatorBorosilicate or high-insulation custom glass
    Hermeticity≤1×10⁻⁸ atm·cc/sec (He leak test)
    Operating Temp.-55°C to +300°C
    Surface FinishNickel plated, gold plated, or blackened
    Dimensional CustomizationAvailable upon customer drawings
    PackagingVacuum sealed, anti-static bag, foam tray

    Application Fields

    • Laser diode and VCSEL packaging

    • Infrared sensor and detector modules

    • Power electronics: IGBT, MOSFET, and high-current transistors

    • RF and microwave device packaging

    • Medical sensor modules requiring hermetic enclosures

    • Aerospace, defense, and industrial electronics


    Available Documentation & Support

    • 2D/3D drawings in PDF or STEP format

    • Helium leak and material composition reports

    • RoHS and REACH compliance certificates

    • OEM/ODM customization available from prototype to volume

    • Technical consulting for packaging layout, sealing process, and thermal design

    • Our R & D department design your product following your own specifcations

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